Magnetic products
Description
Wire Wound on Ferrite core and covered with ferrite board.
Wire Wound on Ferrite core and covered with ferrite board.
Features
• Low profile and very small size SMD Design
• Wound chip construction with standard 252012 to 453228 size
• Great EMI suppression effect at higher frequency over 500MHz
• Low impact to signal wave form
• Low profile and very small size SMD Design
• Wound chip construction with standard 252012 to 453228 size
• Great EMI suppression effect at higher frequency over 500MHz
• Low impact to signal wave form
Applications
• Preventive measure against high speed signal
• Radiation emissions such as USB 2.0
• IEEE1394 or LAN interface
• Best for NB, DSC, mobile device design
• Preventive measure against high speed signal
• Radiation emissions such as USB 2.0
• IEEE1394 or LAN interface
• Best for NB, DSC, mobile device design
| Test Voltage | 1.0V |
| Parameters Test Temp | 25°C |
| Operation Temp (Incl temp rise) | -40℃ to +125℃ |
| Storage Temp | 0~40℃ |
| Storage Humidity | <70% RH |
| Resistance to Soldering Heat | 260℃ for 10 sec |
| Rated Current | |
| Temperature Rise | 40℃ Typ. at Rated Current |
OWICM321619-900
Single Common Mode ChokeAll in series
Product ID
Inductance
DCR [mOhm]
Isat [A]
Irms [A]
Irated [mA]
Idc max [mA]
Q (min)
SRF [MHz]
Samples
Inductors:
Product ID
OWICM321619-900
Inductance
0.00
DCR max:
300.00
IsatA table:
-
Irms A table
0.37
Custom 1:
Custom 2:
Q min:
SRF [MHz] min:
samples visning
L tol note:
Shape and dimensions [mm]
A
B
C
D
E
F
G
H
I
J
Shape
A:
3.20
A tol:
±0.2
B:
1.60
B tol:
±0.2
C:
1.90
C tol:
±0.2
D:
0.65
D tol:
Ref
E:
E tol:
F:
F tol:
G:
G tol:
H:
H tol:
I:
I tol:
J:
J tol:
Shape:
Square
Dimension remarks:
Recommended dimension, a,b,c,d for PCB pad
Dimensions Image: 
PAD Image: 
Schematic Image: 
click images to enlarge
Ole Wolff Elektronik A/S
|
Roedengvej 14, 4180 Soroe, DK Denmark
|
+45 5783 3830
|
sales@owolff.com